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Power chips are connected to external circuits via packaging, and their efficiency relies on the assistance of the product packaging. In high-power situations, power chips are generally packaged as power modules. Chip affiliation refers to the electrical link on the top surface area of the chip, which is typically aluminum bonding cord in conventional modules. ^
Traditional power module package cross-section

Presently, commercial silicon carbide power modules still primarily make use of the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They face issues such as large high-frequency parasitical specifications, not enough warm dissipation ability, low-temperature resistance, and insufficient insulation toughness, which limit the use of silicon carbide semiconductors. The display screen of superb performance. In order to fix these troubles and totally make use of the substantial potential advantages of silicon carbide chips, lots of new product packaging technologies and options for silicon carbide power components have emerged in recent years.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have established from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold wires to copper cables, and the driving pressure is expense decrease; high-power gadgets have actually developed from light weight aluminum cables (strips) to Cu Clips, and the driving force is to improve product performance. The better the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with traditional bonding packaging methods, Cu Clip technology has the following benefits:

1. The link between the chip and the pins is made from copper sheets, which, to a certain level, replaces the standard cord bonding approach between the chip and the pins. Consequently, a distinct package resistance worth, greater present flow, and much better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can fully conserve the expense of silver plating and poor silver plating.

3. The item appearance is entirely constant with regular products and is primarily used in web servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and various other fields.

Cu Clip has 2 bonding approaches.

All copper sheet bonding method

Both eviction pad and the Resource pad are clip-based. This bonding technique is extra costly and intricate, yet it can attain much better Rdson and far better thermal results.

( copper strip)

Copper sheet plus cable bonding method

The resource pad makes use of a Clip technique, and eviction uses a Cord method. This bonding technique is somewhat less expensive than the all-copper bonding technique, conserving wafer area (relevant to extremely little gate areas). The procedure is easier than the all-copper bonding method and can acquire better Rdson and far better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper tape clip, please feel free to contact us and send an inquiry.

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